Intel® Core™2 Duo Processor E7600 (3M Cache, 3.06 GHz, 1066 MHz FSB)
Intel® Virtualization Technology (Intel® VT)
Increasing manageability, security, and flexibility in IT environments, virtualization technologies like hardware-assisted Intel® Virtualization Technology (Intel® VT) combined with software-based virtualization solutions provide maximum system utilization by consolidating multiple environments into a single server or PC. By abstracting the software away from the underlying hardware, a world of new usage models opens up that reduce costs, increase management efficiency, strengthen security, while making your computing infrastructure more resilient in the event of a disaster.
Intel® 64 Architecture
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling very high performance while also meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep Technology switches both voltage and frequency in tandem between high and low levels in response to processor load.
Execute Disable Bit
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network. Help protect your customers' business assets and reduce the need for costly virus-related repairs by building systems with built-in Intel Execute Disable Bit.
Intel Core E7600, Intel® Core™2 Duo, 3.06 GHz, LGA 775 (Socket T), PC, 45 nm, E7600
Intel E7600, Core. Processor family: Intel® Core™2 Duo, Processor frequency: 3.06 GHz, Processor socket: LGA 775 (Socket T). Thermal Design Power (TDP): 65 W, VID Voltage Range: 0.85 - 1.3625 V. Number of Processing Die Transistors: 228 M, Processing Die size: 82 mm², Market segment: DT. Processor package size: 37.5 x 37.5 mm